BowLift | Spraying Tool Tin Solder Paste

Product Features

• SMART DESIGN

A cutting-edge technical support with a distinctive chemical makeup guarantees excellent wetting, offering high dependability. Perfectly designed for mobile phone repairs, computer digital services, and precision SMT/BGA soldering processes on circuit boards.

• SPECIFIC PCB/BGA USE

A premium, singular formula with remarkable performance, effortless soldering, producing shiny, full solder joints without cold soldering or misfires.

• VERSATILE USAGE

The residue that remains is colorless and transparent, allowing for undisturbed detection, making it exceptional with outstanding cleaning capabilities. Utilizing effective, energy-thickening agents ensures even distribution, while fine patterns promise optimal printing results.

• RESISTANT TO BACTERIA

Superb wetting properties, anti-drying effects, and a relatively long shelf life at ambient temperatures. This exceptional, high-quality solder paste comes in a fine, flexible packaging (10 cc/support), with an attractive design.

Storage Guidelines:

• The solder paste should be maintained at a temperature of 1-10℃.
• Prior to unsealing, allow the solder paste to acclimatize to room temperature (25℃), with a recovery duration of approximately 3-4 hours.
• Utilize the solder paste within a period of 6 months.
• Do not expose the solder paste to direct sunlight for storage.

Safety Precautions:

• Operate only in well-ventilated spaces.
• The solder paste includes organic solvents. Minimize skin contact. Should the solder paste come into contact with skin, clean with alcohol and rinse thoroughly with water.
• Avoid contact with eyes.
• Keep out of children's reach.

Technical Details:

• Volume: 10 ml
• Dimensions: 4.13*1.38 inches
• Operating Temperature: 240℃

Package Contents:

• 1 * BGA Syringe Tin Solder Paste